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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/14 tsz02201-0g3g0c200080-1-2 ? 2012 rohm co., ltd. all rights reserved. 5.oct.2012 rev.001 tsz22111 ? 14 ? 001 www.rohm.com datashee t white led driver with pwm brightness control for up to 8 leds in series bd6067gu general description bd6067gu is boost dc/dc converters possible to boost output voltage up to 30v (max.) and drive the white leds at constant. it is possible that turning on white led steadily by a series connection which has no current variation, and by a fa st transient response with current mode. features boost dc/dc converter adjustment of brightness by external pwm pulse possible to driving 8 leds soft start function typical application circuit key specifications ? operating power supply voltage range: 2.7v to 5.5v ? switching frequency: 1.0mhz(typ.) ? quiescent current: 0.1 a (typ.) ? operating temperature range: -30c to +85c package w(typ.) x d(typ.) x h(max.) applications these drivers are applicable for various fields such as mobile phones, portable game machines, inter-phone camera, audio player, portable dvd player, back light for printer display etc? and support light of the camera for the m obile phone, simple flash. and, these can use power supply for oel. pin configuration [bottom view] figure 1. pin configuration v csp85h1 1.68mm x 1.68mm x 1.00mm r1 10 ? sw en gnd vout vfb vin gnda bd6067gu vdac l1 22h cin 1f cout 1f vin d1 20ma off on c1 b1 a1 a2 a3 b3 c3 c2
bd6067gu 2/14 datasheet d a t a s h e e t tsz02201-0g3g0c200080-1-2 ? 2012 rohm co., ltd. all rights reserved. 5.oct.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings (ta=25c) parameter symbol ratings unit conditions terminal voltage 1 vmax1 7 *1 v applicable to vin, en, vfb and vdac pins terminal voltage 2 vmax2 40 *1 v applicable to sw and vout pins operating temperature r ange topr -30 to +85 c storage temperature range tstg -55 to +150 c power dissipation pd 800 *2 mw 50mm58mm1.75mm glass epoxy pcb mounting *1 this value is based on gnd. *2 this loss decreases approximate 6.4mw/c when ta is 25c or more. recommended operating ratings (ta=-30c to +85c) parameter symbol ratings unit conditions operating supply voltage vin 2.7 to 5.5 v vin pin electrical characteristics (unless otherwise stated, ta = 25c and vin = 3.6v.) parameter symbol limits unit conditions min. typ. max. ?l? level input voltage vthl - - 0.4 v ?h level input voltage vthh 1.4 - - v ?h? level input current iih - 18.3 30.0 a en=5.5v ?l? level input current iil -2.0 -0.1 - a en=0v vdac-vfb resistance v dar 56 112 168 k ? quiescent current iq - 0.1 2.0 a en=0v operating current idd - 0.9 1.4 ma en=3.6v, vfb=1.0v vfb pin control voltage vfb 0.18 0.20 0.22 v over current limit icoil 450 600 750 ma *1 sw transistor on resistance ronn - 0.5 1.4 ? isw=200ma switching frequency fsw 0.8 1.0 1.2 mhz maximum duty duty 92.5 95.0 - % vfb=0v output voltage range vo - - 30.0 v over voltage protection ovp 30.0 31.0 32.0 v vfb=0v output open protection ovl - 0.7 1.4 v startup time ts - 0.5 1.0 ms vout=24v *1 the dc current is measured in this item.
bd6067gu 3/14 datasheet d a t a s h e e t tsz02201-0g3g0c200080-1-2 ? 2012 rohm co., ltd. all rights reserved. 5.oct.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 pin description pin number pin name in/out function a1 gnda - analog gnd a2 en in enable control (pull-down by internal resistance) a3 vdac in analog signal input for current adjustment b1 vin - supply voltage input b3 vfb in feedback voltage input c1 vout in over voltage protection input sbd open protection input c2 sw in switching pin c3 gnd - power gnd block diagram + + - osc control + - s q r tsd - + sw en gnd 300k ? - + pwm comp erramp vout vfb vin gnda thermal shutdown 14k ? vdac 98k ? current sense output open protect over voltage protect q1
bd6067gu 4/14 datasheet d a t a s h e e t tsz02201-0g3g0c200080-1-2 ? 2012 rohm co., ltd. all rights reserved. 5.oct.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 typical performance curves figure 5. efficiency vs. led current (6led) (ta=25c) 50 60 70 80 90 100 5 15253545 iled [ma] efficiency [%] vin=3.6v vin=5.5v vin=3.1v figure 2. operating current vs. power supply voltage 0.0 1.0 2.0 3.0 4.0 5.0 2.533.5 44.555.5 vin [v] idd [ma] ta=25c ta = - 3 0 c ta=85c figure 3. quiescent current vs. power supply voltage 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 2.5 3 3.5 4 4.5 5 5.5 vin [v] iq [a] ta=25c ta = - 3 0 c ta=85c figure 4. oscillation frequency vs. power supply voltage 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 2.5 3 3.5 4 4.5 5 5.5 vin [v] switching freqency [mhz] ta=25c ta = - 3 0 c ta=85c
bd6067gu 5/14 datasheet d a t a s h e e t tsz02201-0g3g0c200080-1-2 ? 2012 rohm co., ltd. all rights reserved. 5.oct.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 figure 6. efficiency vs. led current (7led) (ta=25c) 50 60 70 80 90 100 5 15253545 iled [ma] efficiency [%] vin=3.6v vin=3.1v vin=5.5v figure 7. efficiency vs. led current (8led) (ta=25c) 50 60 70 80 90 100 5 15253545 iled [ma] efficiency [%] vin=3.6v vin=3.1v vin=5.5v figure 8. output voltage vs. power supply voltage (8led) 0 500 1000 1500 2000 2500 3000 3500 2.5 3 3.5 4 4.5 5 5.5 vin [v] output power [mw] 1 ta=25c ta = - 3 0 c ta=85c figure 9. vfb pin control voltage vs. power supply voltage (8led) (iled=20ma) 170 180 190 200 210 220 230 2.5 3 3.5 4 4.5 5 5.5 vin [v] vfb [mv] ta=25c ta = - 3 0 c ta=85c
bd6067gu 6/14 datasheet d a t a s h e e t tsz02201-0g3g0c200080-1-2 ? 2012 rohm co., ltd. all rights reserved. 5.oct.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 figure 10. en pin pwm brightness control characteristic (f=100hz, ta=25c) 0 5 10 15 20 25 0 20 40 60 80 100 en duty [%] iled [ma] vin=2.7v vin=3.1v vin=3.6v figure 11. dac brightness control characteristic 0 5 10 15 20 25 0.0 0.5 1.0 1.5 2.0 vdac [v] iled [ma] vin=3.6v vin=2.7v vin=3.1v
bd6067gu 7/14 datasheet d a t a s h e e t tsz02201-0g3g0c200080-1-2 ? 2012 rohm co., ltd. all rights reserved. 5.oct.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 release circuit protection 1) operation bd6067gu is a constant frequency pwm cu rrent mode dc/dc converter. it is shown in the block diagram of page 3 in a pwm comparator forming one of the pwm current mode featur es, one is an error element from the error amplifier and another is an element produced by superimposing the induct or current on a slope waveform that prevents sub-harmonic oscillation. this output c ontrols q1 via the rs latch. energy is stored in an external inductor whileq1 is on and then it is moved to the cout capacitor via d1 while q1 is off. in this way, voltage vout higher than input voltage vin can be obtained. because the above operation is performed in a way that the vfb pin vo ltage equals the vfb voltage, the boost voltage is dominantly determined by the expression ?vf number of leds.? vout voltage = (vf number of leds) + vfb 2) led current control the led current is determined depending on the vfb pi n voltage ?vfb? and the resistance connected to vfb. iled is given below. iled =200mv/ r1 iled [ma] bd6067gu r1 [ ? ] 5 39 10 20 12 16 15 13 20 10 3) dimming control ? control by pwm signal the startup condition of bd6067gu is controlled via the en pi n. it is powered off at 0.4v or less and powered on at 1.4v or more. as shown in figure 12, brightness is cont rolled in the bd6067gu via the pwm signal input the en pin. in this way, the led current is controlled in a range fr om 0 to the maximum current. the avera ge led current increases in proportion to the duty cycle of the pwm signal. in the pwm off cycle, no current dissipation takes place in ic and leds, resulting in high efficiency. duties below 5% and above 95% must no be used for brightness control because they significantly affects the leading and trailing edges. bd6067gu standard pwm frequency ranges from 100hz to 300hz. figure 12. example of brightness control by pwm signal at the en pin pwm 100hz~300hz vin sw en gnd l1 22 f r1 10 ? vin iled gnda vout bd6067gu vdac d1 vfb
bd6067gu 8/14 datasheet d a t a s h e e t tsz02201-0g3g0c200080-1-2 ? 2012 rohm co., ltd. all rights reserved. 5.oct.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 ? control by dc voltage bd6067gu has a built-in function for led current control by dc voltage and can control the current by vdac pin control voltage. over voltage protection bd6067gu has an over voltage protection f eature. when a fault occurs, for exampl e, ic is disconnected from led, an excessive voltage rise may cause the sw pin and vout pi n to exceed the absolute maximum ratings respectively, resulting in ic damage. for this reason, when vout is 30v or more, over voltage protection is activated to turn q1 off so that the sw pin and vout pin don?t ex ceed the absolute maximum ratings. at this time, the ic state changes from active to inactive and the output voltage drops slowly . then, when the output voltage falls below the over voltage protection hysteresis level, the output voltage continues to rise up to 30v again. this protection circuit is shown in figure 15. figure 15. block diagram for short-circuit protection and over voltage protection 1 f r1 10 ? dac vin sw en gnd gnda vout bd6067gu vdac l1 22 h vin d1 iled vfb vfb figure 13. brightness control by bd6067gu dac vout over detecto r control over voltage ref driver sw cout d1 q1 figure 14. dac constant current characteristics by dac control 0 5 10 15 20 25 0 0.5 1 1.5 2 2.5 dac [v] (vfb=200mv) iled [ma]
bd6067gu 9/14 datasheet d a t a s h e e t tsz02201-0g3g0c200080-1-2 ? 2012 rohm co., ltd. all rights reserved. 5.oct.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 startup and rush current bd6067gu has a built-in soft start function. this function prevents the rush current from being generated at startup time. figure 16. soft start circuit application circuit example the output maximum voltage range of bd6067gu is 30v. *** when led has 8 lights, special care should be taken to prevent output voltage (vout) from exceeding 30v. vout = (led vf number of led lights) + vfb figure 17. example of dimming circuit subject to pwm control at the vdac pin + + - osc control + - s q r tsd - + sw gnd 300k ? - + pwm comp erramp vout vfb vin gnda thermal shutdown 14k ? vdac 98k ? curren t sense r1 10 ? 1f 1khz r2 10k ? cout 1f en output open protect over voltage protect d1 l1 22 h cin 1 f vin q1 iled off on tsd - + sw - + vout vin thermal shutdown cout 1f output open protect over voltage protect d1 l1 22h cin 1f vin + + - osc control + - s q r en gnd 300k ? pwm comp erramp vfb gnda 14k ? vdac 98k ? current sense r1 10 ? vdac 0~1.8v off on - soft start circuit q1 iled
bd6067gu 10/14 datasheet d a t a s h e e t tsz02201-0g3g0c200080-1-2 ? 2012 rohm co., ltd. all rights reserved. 5.oct.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 external components selection method <> r1: determines the led curr ent iled at power on. iled (ma) r1[ ? ] 5 39 15 13 20 10 l1: coil for boost. the recommended value is 22h. be sure to use a sufficient dc current permissible value and a sufficient low dc resistance coil. inductance value model number/manufacturer 22h nr3015t220m / taiyo yuden cin: bypass capacitor of power supply. this capacitor must be provided to remove an instantaneous power supply noise for stable voltage supply to this ic. to obtain good characterist ics, the low esr parts like the ceramics capacitor must be used. the recommended capacitance is 1f or more. capacitance value model number/manufacturer 1.0f grm188b11a105ka61b / murata cout: output smoothing capacitor. the capa citance recommended for bd6067gu is 1.0f. capacitance value model number/manufacturer 1.0f umk107c105ka-b / taiyo yuden when selecting capacitors for cin and cout, special care should be taken for rated voltage. the desirable rated voltage is about double the voltage actually applied to the capaci tor. when the margin for rated voltage is not sufficient, the capacitance may be a half or less of the nominal value. d1: schottky barrier diode (sbd) for output rectification. to ac hieve high conversion efficiency, use a diode characterized by of low vf, low reverse leak and high current capacity. model number/manufacturer rb160m-40 / rohm recommended pcb layout when a pcb designed, the power supply line should be wir ed in a way that the board im pedance can be minimized. if necessary, the bypass capacitor must be connected. in particul ar, pins around the dc/dc converter must be wired in such a way that the wiring impedance can be minimized. in additi on, when a dc/dc converter using a coil is used, it is necessary to place the output capacitor cout, coil l1, rectif ication diode d1 and bypass capacitor cin near this ic and keep the gnd impedance low. figure 18. pcb layout image gnda en vdac vin vfb vout sw gnd cin cout to battery gnd r 1 to cell voltage source l1 d 1
bd6067gu 11/14 datasheet d a t a s h e e t tsz02201-0g3g0c200080-1-2 ? 2012 rohm co., ltd. all rights reserved. 5.oct.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 top surface (top view) bottom surface (top view) figure 19. pcb layout ***bypass capacitor and gnd it is necessary to place bypass capacitor cin, coil l1 and power ground gnd near this ic (cin2 of figure 19). to obtain good characteristics, as t he need arises power supply, bypass capacitor cin between analog gnda must be added. (at led8 lights). when led has 8 lights, full assessment is required for characteristics prior to usage.
bd6067gu 12/14 datasheet d a t a s h e e t tsz02201-0g3g0c200080-1-2 ? 2012 rohm co., ltd. all rights reserved. 5.oct.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 operational notes 1) absolute maximum ratings an excess in the absolute maximum ratings, such as supply vo ltage, temperature range of operating conditions, etc., can break down devices, thus making impossi ble to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assum ed, consideration should be given to take physical safety measures including the use of fuses, etc. 2) operating conditions these conditions represent a range within which characteri stics can be provided approximately as expected. the electrical characteristics are guaranteed under the conditions of each parameter. 3) reverse connection of power supply connector the reverse connection of power supply connector can br eak down ics. take protective measures against the breakdown due to the reverse connection, such as mounti ng an external diode between the power supply and the ic?s power supply terminal. 4) power supply line design pcb pattern to provide low impedance for the wiring between the power supply and t he gnd lines. in this regard, for the digital block power supply and the analog block powe r supply, even though these po wer supplies has the same level of potential, separate the power supply pattern for the di gital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns. for the gnd line, give consideration to design the patterns in a similar manner. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply an d the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the ch aracteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. 5) gnd voltage make setting of the potential of the gnd terminal so that it will be mainta ined at the minimum in any operating state. furthermore, check to be sure no terminals are at a potenti al lower than the gnd voltage including an actual electric transient. 6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of t he ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or t he gnd terminal, the ics can break down. 7) operation in strong electromagnetic field be noted that using ics in the strong elec tromagnetic field can malfunction them. 8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connec ted to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each proc ess. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to turn off the power supply and then di smount it from the jig. in addition, for protection against static electricity, establis h a ground for the assembly process and pay thorough attention to the transportation and t he storage of the set pcb. 9) input terminals in terms of the construction of ic, para sitic elements are inevitably formed in re lation to potential. the operation of the parasitic element can cause interference with circuit operation, thus resulting in a malfunct ion and then breakdown of the input terminal. therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals a voltage lower than the gnd respectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applie d to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a volt age lower than the power supply voltag e or within the guaranteed value of electrical characteristics. 10) ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluc tuations in voltages of the small-signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. 11) external capacitor in order to use a ceramic capacitor as the external capaci tor, determine the constant wi th consideration given to a degradation in the nominal capacitance due to dc bias and c hanges in the capacitance due to temperature, etc. 12) thermal shutdown circuit (tsd) when junction temperatures become 175c (t yp.) or higher, the thermal shutdown circuit operates and turns a switch off. the thermal shutdown circuit, which is aimed at isolati ng the lsi from thermal runaway as much as possible, is not aimed at the protection or guar antee of the lsi. therefore, do not continuously use the lsi with this circuit operating or use the lsi assuming its operation. 13) thermal design perform thermal design in which there ar e adequate margins by taking into account the permissible dissipation (pd) in actual states of use. 14) selection of coil select the low dcr inductors to decrease power loss for dc/dc converter. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority.
bd6067gu 13/14 datasheet d a t a s h e e t tsz02201-0g3g0c200080-1-2 ? 2012 rohm co., ltd. all rights reserved. 5.oct.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 ordering information b d 6 0 6 7 g u - e 2 part number package gu : vcsp85h1 packaging and forming specification e2: embossed tape and reel marking diagram physical dimension tape and reel information ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs e2 () direction of feed reel 1pin (unit : mm) vcsp85h1 (bd6067gu) s 0.08 s a b b a 0.05 1pin mark 3 0.34 0.1 8- 0.3 0.05 1.68 0.1 2 ( 0.15)index post c 1 0.34 0.1 b 1.0max 1.68 0.1 a 0.25 0.1 p=0.5 2 p=0.5 2 vcsp85h1 (top view) 6067 part number marking lot number 1pin mark
bd6067gu 14/14 datasheet d a t a s h e e t tsz02201-0g3g0c200080-1-2 ? 2012 rohm co., ltd. all rights reserved. 5.oct.2012 rev.001 www.rohm.com tsz22111 ? 15 ? 001 revision history date revision changes 05.oct.2012 001 new release
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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